SENSOR+TEST in Nuremberg
You can find us in hall 5 booth 318
Next week it's time! The preparations of Microdul AG are in full swing.
Come by and visit us at the SENSOR+TEST in Nuremberg. You can find us in hall 5 booth 318. The SENSOR+TEST will take place from June 25th to 27th
Our three business areas comprise:
- Module development (miniaturization from prototype to mass production)
- Semiconductor (Custom Solutions - ASICs or Standard Products - ASSPs)
- Thick film (carrier material Al2o3, AIN, steel,
Cu, DCB,...)
Excerpt from the processing
possibilities:
- Flex, rigid-flex, PBC's, SMD (01005), THT, Chip on Board (COB), Flip-Chip,
BGA, CSP, PoP, .....
- Vacuum soldering, laser trimming, testing, milling, Au and Al bonding, Die to
Die Bonding, .....
- Dam and filling technology (also transparent), underfill, ....
There are many good reasons to visit this year's SENSOR+TEST.
If you have any questions, please do not hesitate to contact me.



