Techno Blog

New Homepage

183:762796948 (Roland Steger) — Thu, 29 Sep 2022 08:37:39 GMT

New Homepage

Our new homepage - come and have a look

https://www.steger-productmarketing.com/

We are your partner for reliable and successful product marketing & sales

#microTEC Südwest Clusterkonferenz (digital) 2021 vom 16.3.-18.3.2021

183:762796948 (Roland Steger) — Tue, 09 Mar 2021 21:43:31 GMT

Quelle: microTec Südwest

Für die #Microdul AG hält Herr Phil Pool als Experte für Integrierte Schaltkreise einen Vortrag über Cyber Physisches Systeme auf der #microTEC Südwest Clusterkonferenz.

Des Weiteren möchten wir Sie auf unseren virtuellen Messestand der #Microdul AG einladen.

Vom Engineering, Materialbeschaffung, Produktion bis hin zum Test aktiver Implantate beherrscht Microdul sämtliche Prozesse der einzelnen Entwicklungszyklen.

Kontaktdaten:

Roland.Steger@microdul.com

Social.Media@roland-steger.de

#automotivenews DVN-I Newsletter № 47

183:762796948 (Roland Steger) — Tue, 02 Mar 2021 13:15:56 GMT

Electronic Challenges in Smart Interior Lighting

Source: Melexis

Interior lighting is interesting for carmakers and customers like never before. Consequently there is a growing trend towards a multi-functional and increasing complex dynamic lighting in the vehicles.

Once smart lighting effects become specified for both styling and communication purposes, certain technical challenges arise. Notably, the capabilities of the current CAN and LIN communication protocols are insufficient. CAN is the Controller Area Network; the bus that allows components in an automobile to talk to each other seamlessly. LIN is the Local Interconnect Network; a supplement to CAN which allows for further expansion to peripheral devices. Tomorrow’s cars are likely to contain too many LEDs changing color too rapidly and too frequently for the current CAN and LIN technologies to control efficiently.

The latest CAN protocol – CAN-FD – has sufficient bandwidth, but because of its architecture and requirements it is too expensive from a Bill of Materials point of view and too limited in regard to the number of possible connected LED drivers. The communication speed and architecture of LIN makes it a feasible solution for slow animations, but not for high-speed applications.

In parallel, the number of RGB-LEDs is increasing, making system integration even more complex, especially when different color sensitivities need to be adjusted separately. At the same time, OEMs do not wish to limit such exciting new features to their high-end cars, and so are looking for high performance at a low cost.

Further challenges include: ensuring the necessary flexibility in the car architecture for smart lighting without reprogramming the body control module; managing safety-critical applications; ensuring overall system EMC and ESD robustness in such a harsh environment; and fulfilling space requirements to fit smart lighting in any location within the car.

The Melexis solution for smart automotive lighting

Source: Melexis – Block diagram

Melexis is a global supplier of micro-electronic semiconductor and was also present at CES 2021 with a virtual booth.

To address the challenges of smart lighting, Melexis has developed the  Melexis Light Bus  (MeLiBu™). It combines LIN and CAN: the easily usable, extendable protocol and hardware architecture of LIN with the speed and robust communication system of CAN. The result is a high-speed, robust communication system specifically designed for applications with both high numbers of LEDs and high levels of animation, complexity, and dynamic range. It’s a license-free system based on the existing CAN-FD physical layer and UART communication with self-synchronization. Moreover, MeLiBu™ ensures the seamless integration of LED systems from different tier suppliers, and is suitable for safety-critical applications up to ASIL-B classification.

MeLiBu™ supports a simple wiring harness thanks to its real differential bus structure. Simplicity also extends to the synchronization of light animations over the whole car – with delay-free communication between multiple of hundreds of LEDs. It also enables numerous bus segments to be distributed over the full car. MeLiBu™ offers  ESD and EMC robustness to low cost per light node and is  ISO 11898 and ISO 26262 compatible .

MeLiBu™ is thus qualified for smart lighting applications such as the overhead module, instrument pack, interior and exterior decorative lighting, and warning lights. Another key application is the integrated dashboard light, where MeLiBu™ improves communication between car and driver in a similar way to virtual assistant AI technology. Each lighting element can be added into the overall vehicle lighting concept selectively, by brand, model, platform, feature or function. Implementation of any color coding, color changing and blinking sequence is simple and scalable.

The very flexible high-speed automotive bus facilitates the car manufacturers towards more complex smart lighting without having to rethink the complete body control unit system. Multiple OEMs have already validated and implemented MeLiBu™, with the first models already on the road.

Depending on the application and space requirements, Melexis offers single- and multi-channel control modules for the different system solutions. The Product Overview below shows the current LED Driver modules with LIN and MeLiBu Interface, communication speed and the number of LED driver channels.

The MLX81116 is a fully integrated intelligent automotive LED driver with robust high-speed communication (MeLiBu™/ 1-2MBt/sec) between multiple LED drivers to enable high RGB LED count applications for dynamic in-vehicle lighting. All components for LED driving and communication are integrated, enabling the development of cost-optimized animated lighting systems. The embedded intelligence enables a high accuracy of RGB color mixing as well as support for ASIL B applications thanks to the MeLiBu™ communication system.

Source: Melexis – System Design 1

Some features and benefits of MLX81116 module

MCU for advanced LED control algorithm, color mixing and full diagnostics
Red/green and blue LED temperature compensation without additional external components
Color mixing accuracy of 1% delta UV
16-bit color/intensity control
Storage of LED calibration data directly in the LED driver
Low side programmable calibrated current sources for LED control
Direct and multiplexed LED drive without additional external components
LEDs fully diagnosable (short circuit, broken wire, threshold monitor
Real-time updating of >250 RGB LEDs without delay

There is a variety of new MeLiBu LED driver products just before public release.

If you want or need more information, please do not hesitate to contact us.

#Melexis launched the #MLX81116 a multichannel RGB-LED driver

183:762796948 (Roland Steger) — Thu, 01 Oct 2020 07:03:12 GMT

#Melexis Launched the #MLX81116 a Multichannel RGB-LED Driver

#Melexis launched the #MLX81116 a multichannel RGB-LED driver the first device to support the MeLiBu™ a high- speed communication interface enabling #automotive manufacturers to provide enhanced features for #animated #lighting functions.

The #MeLiBu™ communication interface is working with the proven CAN-FD physical layer, which ensures robustness, reliability, and high speed (up to 2 Mbit); features that are key requirements for today’s car manufacturers. Meeting automotive ISO 26262 functional safety requirements up to safety integrity level B (ASIL B).

For more information you can visit the Melexis-Homepage: www.melexis.com

https://www.melexis.com/en/news/2020/27aug2020-melexis-mlx81116-multichannel-rgb-led-driver

A video shows the capability of the multichannel RGB-LED driver.

https://www.youtube.com/watch?v=tUNZJFLfEqw#action=share

If you do not find what are you looking for, you can also contact me.

Sensor im Automobil

Thu, 17 Sep 2020 21:01:45 GMT

8. Fachtagung - Sensor im Automobil - 17-18.09.2020 in München

Dear Community,

in this COVID19 challenging times a lot is changing, but we all are on the way to handle this pandemic situation. To join virtual or hybrid events are going to be the new normal.

The event “Sensor im Automobil” is a hybrid conference focusing on #automotive manufacturers, #sensor suppliers and research institutions to discuss innovative sensor principles under application-related focus. In addition optimizing well-known sensor principles, new sensor systems are becoming increasingly important for generating additional information for the #ADAS-Systems.

Get an overview of the most important trends in sensor technology. I would like dive your attention to an presentation from #Melexis of an 3D #Time-of-Flight-Sensor:

“Miniaturisierte 3D Time-of-Flight-Kamera zur Innenraumüberwachung und Gestensteuerung im Automotive”

Agenda:

https://sensoren-im-automobil.de/programm-2020/

Or if you have no time for the conference visit the Melexis Homepage directly

https://www.melexis.com/en/news/2018/13nov2018-qvga-tof-chipset-incabin-monitoring-systems

https://www.melexis.com/en/news/2017/20nov2017-tofmotion---melexis

Best regards,

Social.Media@Roland-Steger.de

Automotive LED and RGB LED Controller

Thu, 10 Sep 2020 06:42:09 GMT

This is a subtitle for your new post

Dear Community,

as a Technology Scout, I would like to drive your attention to a newly released device from #Melexis.

This device is used for dynamic ambient interior lighting with #RGB-LEDs. Were speed, accuracy and robustness matters.

It's not only the colour mixing with an integrated temperature compensation, it is the accuracy of < 1% delta UV, the supply range, fully diagnosable (Short circuit, broken line, threshold monitor), #ASIL B classification QFN4x4 package, 24 pins.

You can drive more the 250 RGB-LED’s on real bus without any delay.

For more information, you have the following links available:

https://www.melexis.com/en/news/2020/27aug2020-melexis-mlx81116-multichannel-rgb-led-driver

https://youtu.be/tUNZJFLfEqw

For more information, please visit www.melexis.com.

Melexis downloads area (Melexis.com):

• Product flyer for MLX81116

• MeLiBu™ flyer

• Selection guide for Automotive LED and RGB LED Controller

#Swiss_Medtech_Day

Thu, 10 Sep 2020 06:34:39 GMT

This is a subtitle for your new post

Unsere Vorbereitungen für die #Swiss_Medtech_Day laufen auf Hochtouren.

Die Veranstaltung findet am Montag, 21. September 2020 von 08:30 - 17:00h in CH- Bern statt.

Die Firma #Microdul AG stellt dort High-Tech im Bereich von #aktiven #Implantaten der Klasse 3.

Wenn sie mehr über aktive #Implantate wissen möchten besuchen Sie meine Webseite:

https://www.roland-steger.de/aktive-implantate

#Elektronisches_Türschloss - #Elektronisches_Schließsystem

Thu, 10 Sep 2020 06:21:18 GMT

#Elektronisches_Türschloss - #Elektronisches_Schließsystem

#Elektronisches_Türschloss

Sie können den Energieaufwand von elektronischen Schließsystemen reduzieren, indem sie nur die Bereiche der Elektronik einschaltet, die für die Funktion gerade benötigt werden. Denkbar ist auch der Einsatz von „#Energy-Harvesting“ bei dem effizientes #Power-Management gefragt

Value Proposition:

- Energie sparen

- Aufwachen durch Berührung oder zeitlich gesteuert

- Power Management für Energy Harvesting

- Kein Batteriewechsel mehr ?

- Zeitstempel (Real Time Clock)

- Kleinste Verpackungen (z.B. Chip Scale Package)

Mehr Info zum #Elektronisches_Türschloss - #Elektronisches_Schließsystem unter:

https://www.roland-steger.de/elektronisches-t%C3%BCrschloss

Energy Harvesting

183:762796948 (Roland Steger) — Tue, 07 Jul 2020 12:57:19 GMT

Energy Harvesting, heißt sammeln und Speichern von kleinen Energievorkommen

Eingangsgrößen für den Harvester könnten sein:

Kinetische-, Thermische- Strahlungs- Energie, Federmasse- Systeme, Linearbewegung, Rotationsbewegung, Schock und Stöße z.B beim Gehen, Fahrradfahren, Schuhsole, usw.

Die verwendeten Powermanager müssen mit einem hohen Wirkungsgrad arbeiten bzw. intelligent und stromsparend gesteuert werden.

Charge Pump

DC/DC Wandler

Optimierte Verfahren bei Piezo Anwendungen => hoher Wirkungsgrad

Stromsparende Timer- Funktionen

Geringe Versorgungsspannungen

Bei Energy Harvesting Applikation genügt es nicht, die Einzelkomponenten zu betrachten.

Entscheidend ist hier gesamtheitliche Betrachtung der Applikation.

Zum Beispiel:

Was für Anforderungen stellt meine Sensor (Energieverbrauch)

Was kann meine Energy Harvesting Quelle an Energy wann liefern

Wie lange muss bzw. kann die Energie gespeichert werden

Was muss wie oft gemessen werden

Wie sollen die Daten übertragen werden (BLE, ZigBee, Lora, usw,..)

Wann und wie oft soll eine Übertragung stattfinden

Was ist der Energiebedarf während eines Updates des Sensors

Was ist der Energiebedarf während einer Sonderfunktion

Haben Sie Fragen zu einer unserer Kernkompetenz dann freuen wir uns über Ihre Kontaktaufnahme.

Gerne unterstütze wir Sie bei Ihrem Projekt. Sprechen Sie uns an, wir helfen Ihnen gerne weiter.

Kontakt:

Tel : +49 7275 9487675

BDS@microdul.com

MedTecLIVE goes Virtual June 30 to July 2, 2020

183:762796948 (Roland Steger) — Thu, 02 Jul 2020 08:15:57 GMT

Final sprint at MedTecLIVE, the last day of the fair has begun.

Everything is a bit new and virtual but an attempt to get in touch with you in these ways and introduce you to the skills of Microdul.

Visit us at MedTecLIVE, we look forward to further interesting discussions.

https://www.medteclive.com/de/virtuelles-event#FrBesucher

We can offer their complete solutions from prototype to mass production.

We present the three business areas of Microdul AG:

- Module development

- Semiconductors

- Thick layer

As an ISO 9001 and ISO13485 certified specialist for high-quality microelectronics, Microdul masters all processes from engineering to customer-specific production.

Wir sind weiterhin für Sie da

183:762796948 (Roland Steger) — Fri, 17 Apr 2020 09:33:41 GMT

Wir sind weiterhin für Sie da / We are still there for you

Wir beraten und unterstützen unsere Kunden im Aufbau und Ausbau profitabler und neuer Vertriebswege.

https://www.roland-steger.de/kontakt - In unserer heutigen technologisch geprägten Welt benötigt man eine strukturierte Vorgehensweise im Unternehmen, um dem Konkurrenzdruck Stand zu halten.

We advise and support our customers in the development and expansion of profitable and new distribution channels.

https://www.roland-steger.de/kontakt - In today's technologically shaped world, a structured approach is needed in the company to withstand competitive pressure.

MD&M West 2020

183:762796948 (Roland Steger) — Mon, 27 Jan 2020 13:36:47 GMT

Visit us at the MD&M West 2020 in the Anaheim Convention Center
CA, Kalifornien

The MD&M West 2020 will take place from 11.- 12.02.2020.

We would be very pleased if we could welcome you at booth No. 2968.

Microdul's three business units include:

- Module development (miniaturization from prototype to mass production)

- Semiconductor (Customer-specific solutions - ASICs or standard products - ASSPs)

- thick layer (carrier material made of Al2o3, AIN, steel, Cu, DCB,.....)

Extract from the processing options:

- Flex,, rigid-flex-, PBC's, SMD (01005), THT, Chip on Board (COB), Flip-Chip, BGA, CSP, PoP, .....

- Vacuum soldering, laser trimming, testing, milling, Au- and Al Bonding, Die to Die Bonding, .....

- Dam and filling technology (also transparent), underfill, ....

If you have any questions or appointments, please do not hesitate to contact us.

https://www.roland-steger.de/microdul-ag

North American Neuromodulation Society Conference 2020 in Las Vegas, NV

183:762796948 (Roland Steger) — Tue, 07 Jan 2020 14:03:54 GMT

Visit us at the North American Neuromodulation Society Conference 2020

in Las Vegas, NV.

The North American Neuromodulation Society 2020 will take place from 23.- 26.01.2020.

We would be very pleased if we could welcome you at booth No. 427.

Microdul's three business units include:

- Module development (miniaturization from prototype to mass production)

- Semiconductor (Customer-specific solutions - ASICs or standard products - ASSPs)

- thick layer (carrier material made of Al2o3, AIN, steel, Cu, DCB,.....)

Extract from the processing options:

- Flex,, rigid-flex-, PBC's, SMD (01005), THT, Chip on Board (COB), Flip-Chip, BGA, CSP, PoP, .....

- Vacuum soldering, laser trimming, testing, milling, Au- and Al Bonding, Die to Die Bonding, .....

- Dam and filling technology (also transparent), underfill, ....

If you have any questions or appointments, please do not hesitate to contact us.

COMPAMED 2019 in Düsseldorf

183:762796948 (Roland Steger) — Tue, 05 Nov 2019 14:44:26 GMT

Visit us at the COMPAMED 2019

You will find us at booth F19 in Hall 8A.

COMPAMED 2019 in Düsseldorf

duda-owner-ionos@ionos.com (Duda Owner IONOS) — Tue, 29 Oct 2019 09:07:30 GMT

Microdul AG auf der Fachmesse COMPAMED 2019 in Düsseldorf

Fachmesse COMPAMED 2019 in Düsseldorf - 18. November - 21. November 2019.

Besuchen Sie die Microdul AG, Sie finden uns am Messestand F19 in der Halle 8A.

Die drei Geschäftsbereiche von Microdul umfassen:

- Modulentwicklung (Miniaturisierung vom Prototyp bis zur Massenproduktion)

- Semiconductor (Kundenspezifische Lösungen - ASICs oder auch Standard Produkte - ASSPs)

- Dickschicht (Trägermaterial aus Al2o3, AIN, Stahl, Cu, DCB,…..)

Haben Sie Fragen oder möchten vorab schon einen Termin vereinbaren dann würde ich mich über eine Kontaktaufnahme freuen.

https://www.roland-steger.de/kontakt

Lassen Sie uns in den Austausch gehen !

Medtech & Pharma 2019

duda-owner-ionos@ionos.com (Duda Owner IONOS) — Wed, 09 Oct 2019 08:25:50 GMT

Visit Microdul AG at the Medtech & Pharma 2019 in Basel

It will take place from 24 October to 25 October 2019.

Adrian Stalder will be your local contact.

We would be very pleased if we could welcome you at booth no. 16.

Microdul's three business units:

- Module development (miniaturization from prototype to mass production)

- Semiconductors (customer-specific solutions - ASICs or standard products - ASSPs)

- thick layer (carrier material made of Al2o3, AIN, steel, Cu, DCB,.....)

Extract from the processing options:

- Flex,, rigid-flex-, PBC's, SMD (01005), THT, Chip on Board (COB), Flip-Chip, BGA, CSP, PoP, .....

- Vacuum soldering, laser trimming, testing, milling, Au- and Al Bonding, Die to Die Bonding, .....

- Dam and filling technology (also transparent), underfilling, ....

At Medtech & Pharme we will show you our latest innovations!

If you have any questions or would like to make an appointment, I would be happy to get in touch.

Human Body Detector

183:762796948 (Roland Steger) — Wed, 04 Sep 2019 10:10:27 GMT

In addition to its range of services in AVT (construction and connection technology), Microdul AG also presents its kapazitiven evaluation modules for sensors. T

his enables low current sensor applications in the area of capacitive, switch, touch, proximity, fluid.

For example: "Human Body Detector" on the MS889X family. In the function as a switch, the external sensor capacity is compared with a programmable threshold and thus an overort of the threshold is detected.

Applications

• "Human Body Detection" (e.g. "In-Ear" headphones or finger recognition)

• Wrist detection (e.g. "wearables" or medical devices)

• Liquid detection (e.g. coffee machines)

• Proximity sensor

• Proximity switch

• Touch switch

If you have any questions about one of our products, we look forward to hearing from you.

We are happy to support you in your project. Contact us, we will be happy to help you.

Our e-mail address BDS@microdul.com

Microdul AG - Swiss Medtech Expo 2019 in Lucerne

183:762796948 (Roland Steger) — Tue, 13 Aug 2019 11:46:36 GMT

Visit us at the Swiss Medtech Expo 2019 in Lucerne

The preparations of Microdul AG are in full swing, with the Swiss Medtech Expo taking place from 10 to 11 September 2019.

We would be very pleased if we could welcome you to our booth A 2026 in hall 2.

Microdul's three business units:

- Module development (miniaturization from prototype to mass production)

- Semiconductors (customer-specific solutions - ASICs or standard products - ASSPs)

- thick layer (carrier material made of Al2o3, AIN, steel, Cu, DCB,.....)

At Swiss Medtech Expo 2019, we will show you our latest innovations!

If you have any questions, I would be pleased to contact BDS@microdul.com.

Microdul AG - Manufacture of customer-specific microelectronics

183:762796948 (Roland Steger) — Tue, 06 Aug 2019 13:33:19 GMT

Customer-specific microelectronics

Since 1991, Microdul AG has been one of the specialists in miniaturization of high-quality microelectronic circuits. The focus is on customer-specific microelectronics. Microdul AG has a broad portfolio of modern manufacturing technologies. Flexible working and measuring stations allow excellent quality and delivery reliability even for small quantities.

As an ISO9001 and ISO13485 certified specialist, the portfolio of Microdul AG covers a wide range. Starting in medical electronics for hearing aids and active implanted medical devices (Class 3) and various electronic circuits in industry to timing applications, performance industry, safety technology, energy harvesting and sensor technology. We would like to support you in the production of your customer-specific assembly.

If you have any further questions, please contact us at the following e-mail address.

Contact: BDS@microdul.com

Microdul AG – Easy to use! Your partner for capacitive sensors

183:762796948 (Roland Steger) — Wed, 31 Jul 2019 08:53:46 GMT

As specialists for capacitive sensors application, we offer our customer application support and help them during the integration. For this purpose, we have a wide, modern range of sensing circuits.

Our company is ISO 9001 and ISO 13485 certified.

SENSOR+TEST in Nuremberg

Mon, 17 Jun 2019 12:15:48 GMT

You can find us in hall 5 booth 318

Next week it's time! The preparations of Microdul AG are in full swing.

Come by and visit us at the SENSOR+TEST in Nuremberg. You can find us in hall 5 booth 318. The SENSOR+TEST will take place from June 25th to 27th

Our three business areas comprise:

- Module development (miniaturization from prototype to mass production)
- Semiconductor (Custom Solutions - ASICs or Standard Products - ASSPs)
- Thick film (carrier material Al2o3, AIN, steel, Cu, DCB,...)

Excerpt from the processing possibilities:
- Flex, rigid-flex, PBC's, SMD (01005), THT, Chip on Board (COB), Flip-Chip, BGA, CSP, PoP, .....
- Vacuum soldering, laser trimming, testing, milling, Au and Al bonding, Die to Die Bonding, .....
- Dam and filling technology (also transparent), underfill, ....

There are many good reasons to visit this year's SENSOR+TEST.

If you have any questions, please do not hesitate to contact me.

Die nächste Messe kommt

Tue, 28 May 2019 12:08:05 GMT

SENSOR+TEST 2019 in Nürnberg

Unsere Vorbereitungen sind im vollem Gange, vom 25.-27. Juni findet die SENSOR+TEST in Nürnberg statt. Sie finden uns am Stand 5-318.

Unsere drei Geschäftsbereiche umfassen:

- Modulentwicklung (Miniaturisierung vom Prototyp bis zur Massenproduktion)

- Semiconductor (Kundenspezifische Lösungen - ASICs oder auch Standard Produkte - ASSPs)

- Dickschicht (Trägermaterial aus Al2o3, AIN, Stahl, Cu, DCB,…..)

Auszug aus den Verarbeitungsmöglichkeiten:

- Flex-, Starrrflex-, PBC’s, SMD (01005), THT, Chip on Board (COB), Flip-Chip, BGA, CSP, PoP, …..

- Vakuum Löten, Laser Trimmen, Testen, Fräsen, Au- und Al Bonding, Die to Die Bonding, …..

- Damm- und Fülltechnologie (auch transparent), Underfill, ….

Für einen Besuch der diesjährigen SENSOR+TEST gibt es sehr viele gute Gründe.

Haben Sie Fragen, dann würde ich mich über eine Kontaktaufnahme freuen.

rst@roland-steger.de oder telefonisch unter der 07275 / 9487675

The MedtecLIVE !

Fri, 17 May 2019 10:43:38 GMT

MedtecLIVE you will also find Microdul AG

Next week on Tuesday 21 May 2019 we will start ! The MedtecLIVE ! Among the exhibitors at MedtecLIVE you will also find Microdul AG in hall 9 booth 616.
We will present the three business divisions of Microdul AG:
- Module development
- semiconductor
- thick film

Product News: Evaluation module for capacitive sensors. The MS889X series are capacitive sensors and switches which have been specially developed for use in wearables. When the MS889X acts as a switch, an external sensor capacitance is compared with a programmed threshold to determine whether the external value is above or below the threshold. The MS889X series has ultra-low power consumption (750nA) between 1.8V and 4.5V and is ideal for use in battery-powered systems. There are numerous programming options for easy integration into an electronic system. Important parameters can be programmed into a non-volatile memory for autonomous operation.

Applications:
- Recognition of the human body
- wrist recognition
- liquid detection
- proximity sensor
- proximity switches

MedtecLIVE 21-23 May 2019

Tue, 30 Apr 2019 10:17:59 GMT

The new top event of the medical technology industry

There are many good reasons to visit this year's MedtecLIVE, e.g. the parallel MedTech Summit congress in addition to the trade fair. But also a visit to Microdul AG

We are looking forward to your visit in hall 9 booth 616.

https://www.microdul.com/de/

At MedtecLIVE in Nuremberg, Microdul AG will present its #capacitive evaluation modules for sensors in addition to its range of services in the #AVT (assembly and connection technology). This enables #Low Current #Sensor applications in the areas #Capacitive , #Switch , #Touch , #Proximity , #Fluid .

Example: "Human Body Detector" MS8890

If you have any further questions, please do not hesitate to contact us at rst@roland-steger.de or Roland.Steger@microdul.com, by phone at

07275 9487675 or visit us at our

Homepage https://www.roland-steger.de/kontakt

microTEC Südwest Clusterkonferenz 2019

Fri, 12 Apr 2019 11:43:48 GMT

Vorstellung der 3 Geschäftsbereiche der Microdul AG Auf der microTEC Südwest Clusterkonferenz 2019 im Konzerthaus in Freiburg hat die Microdul AG ihre drei Geschäftsbereiche vorgestellt.

Die drei Geschäftsbereiche umfassen:

Modulentwicklung (Miniaturisierung vom Prototyp bis zur Massenproduktion)

Semiconductor (Kundenspezifische Lösungen - ASICs oder auch Standard Produkte - ASSPs)

Dickschicht (Trägermaterial aus Al2o3, AIN, Stahl, Cu, DCB,…..)

Auszug aus den Verarbeitungsmöglichkeiten:

- Flex-, Starrflex-, PBC’s, SMD (01005), THT, Chip on Board (COB), Flip-Chip, BGA, CSP, PoP, …..

- Vakuum Löten, Laser Trimmen, Testen, Fräsen, Au- und Al Bonding, Die to Die Bonding, …..

- Damm- und Fülltechnologie (auch transparent), Underfill, ….

Als #ISO9001 und #ISO13485 zertifizierter Spezialist für qualitativ hochwertige Mikroelektronik beherrscht Microdul sämtliche Prozesse vom Engineering bis zur Produktion kundenspezifischer Anwendungen.

Unser fundiertes Know-how erstreckt sich vom ASIC-Design bis zur miniaturisierten Elektronik.

Gerne lade ich Sie zu dem nächsten Event nach Nürnberg auf die MedTecLIVE ein.

Die MedTecLIVE findet vom 21 bis 23 Mai 2019 statt. Sie finden die Microdul AG in Halle 9 Stand 616 (9-616). Die Microdul AG würde sich über einen Besuch freuen.

#medical #medicaldevices

Ebenso empfehlenswert die T4M2019 Technology for Medical Devices vom 07.-.09. Mai 2019 auf der Landesmesse in Stuttgart

Medtec LIVE 21.-23 Mai 2019

183:762796948 (Roland Steger) — Tue, 26 Mar 2019 15:50:38 GMT

DAS neue Top-Event der Medizintechnik-Branche

Für einen Besuch der diesjährigen Medtec LIVE gibt es sehr viele gute Gründe. z. B. neben der Fachmesse der parallel stattfindende Kongress MedTech Summit. Aber auch ein Besuch bei der Microdul AG.

Wir freuen uns schon auf Ihren Besuch in Halle 9 Stand 616

https://www.microdul.com/de/

microTEC Südwest Clusterkonferenz

183:762796948 (Roland Steger) — Mon, 18 Mar 2019 11:55:15 GMT

Vom 20.03.2019 – 21.03.2019 in Freiburg

https://www.microtec-suedwest.de/news-termine/clusterkonferenz/clusterkonferenz-2019

Im Ausstellungsbereich Stand 19, finden Sie die Microdul AG

https://www.microdul.com/de/news/

Microdul AG – Hochwertige MIKROELEKTRONIK

Ihrem umfassenden Spezialisten für hochwertige Mikroelektronik. Von der Entwicklung und dem Engineering über die Produktion bis hin zum Test kundenspezifischer Anwendungen beherrschen wir sämtliche Prozesse aller Entwicklungszyklen. Damit begeistern wir unsere Kunden.

Microdul verfügt über ein breites und tiefes Know-how in der vielfältigen Welt der Mikroelektronik – ein Know-how, das wir mit den drei Geschäftsbereichen Semiconductors, Mikromodule und Dickschichttechnik in überzeugende Produkte und Dienstleistungen umsetzen.
Die Zertifizierungen nach ISO 9001 und 13485 unterstreichen unsere hervorragenden Prozesse ebenso wie die zahlreichen, erfolgreich bestandenen Kundenaudits. Ob Standardprodukt oder individuelles Design – mit Microdul als Partner an Ihrer Seite meistern Sie jede Hürde erfolgreich.

https://www.microdul.com/de/

Haben Sie weiter Fragen dann freuen wir uns über Ihre Kontaktaufnahme unter

rst@roland-steger.de, 07275 9487675 oder https://www.roland-steger.de/kontakt

Are you ready for compliance testing from physical to upper layers of automotive Ethernet?

Thu, 07 Mar 2019 09:18:02 GMT

#Automotive #Ethernet and AVB/TSN – Overview, testing & demo TC8 conformance testing regarding AUTOSAR Service Primitives Automotive Future Outlook

From Keysight’s Automotive & Energy solutions group, Ixia solutions group, and IHR GmbH.
http://www.ihr.de/index.php/en/newsletter-english/489-keysight-event-2

They invite you to a full-day technical session which will enable you to understand and tackle existing challenges posed by automotive Ethernet, and equip you with tools and confidence to face the challenges still to come. Topics Covered: Physical Layer Testing Introduction to Ethernet- and IP-based communication Transmitter & receiver testing & demo (BroadR-Reach, IEEE 100Base-T1, IEEE 1000Base-T1) Link segment testing & demo Layer 2 to 7 Testing using Ixia Solutions #Automotive #Ethernet and AVB/TSN – Overview, testing & demo TC8 conformance testing regarding AUTOSAR Service Primitives Automotive Future Outlook Attendance is free of charge but seats are limited, so make sure you register now.
https://www.keysight.com/de/de/events/europe-middleeast-africa-india/seminars/automotive-ethernet-seminar-day.html

IHR GmbH News Februar 2019 - March,14 2019

183:762796948 (Roland Steger) — Mon, 25 Feb 2019 07:45:11 GMT

Automotive Ethernet Testing

Are you ready for compliance testing from physical to upper layers of automotive Ethernet?

With significantly increasing demands for high data rate, bandwidth, data security, and future-readiness,automotive Ethernet is the obvious choice over traditional automotive serial buses forin-vehicle data connections and communications.

It is an enormous task to overcome test challenges across all layers of automotive Ethernet,to understand the constantly evolving standards and test methodologies,and to comfortably anticipate future requirements. Towards this end, we have gathered expertsfrom Keysight’s Automotive & Energy solutions group, Ixia solutions group, and IHR GmbH.

We invite you to a full-day technical session which will enable you to understand and tackle existing challenges posed by automotive Ethernet, and equip you with tools and confidence to face the challenges still to come.

http://www.ihr.de/index.php/de/newsletter-deutsch/488-keysight-event

Impressions of the 5th Automotive Ethernet Congress in Munich

Thu, 21 Feb 2019 13:27:31 GMT

Impressions of the 5th Automotive Ethernet Congress in Munich

Last week I had the opportunity to talk with Mr. Thomas Fomferra from IHR GmbH in Rheinmüster about his impressions of the 5th Automotive Ethernet Congress in Munich, where he talked about the reduction of the ever more complex vehicle networking and how far today's established bus systems can still achieve this. Since more than 5 years the #Automotive #Ethernet based on Broadcom ́s BroadR-Reach is available in one or the other vehicle. Since IHR GmbH attaches great importance to testing the interoperability of the different bus systems, IHR GmbH offers certified Layer 1 to 7 tests for Ethernet.

http://www.ihr.de/index.php/de/conformance-tests

If you have any further questions, please do not hesitate to contact us at rst@roland-steger.de or +49 (0) 7275 9487675, https://www.roland-steger.de/kontakt

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Final sprint at MedTecLIVE, the last day of the fair has begun.

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Wir sind weiterhin für Sie da / We are still there for you

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Visit us at the MD&M West 2020 in the Anaheim Convention Center CA, Kalifornien

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Visit us at the COMPAMED 2019

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Visit us at the Swiss Medtech Expo 2019 in Lucerne

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You can find us in hall 5 booth 318

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SENSOR+TEST 2019 in Nürnberg

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MedtecLIVE you will also find Microdul AG

MedtecLIVE 21-23 May 2019

The new top event of the medical technology industry

microTEC Südwest Clusterkonferenz 2019

Vorstellung der 3 Geschäftsbereiche der Microdul AG Auf der microTEC Südwest Clusterkonferenz 2019 im Konzerthaus in Freiburg hat die Microdul AG ihre drei Geschäftsbereiche vorgestellt.

Medtec LIVE 21.-23 Mai 2019

DAS neue Top-Event der Medizintechnik-Branche

microTEC Südwest Clusterkonferenz

Vom 20.03.2019 – 21.03.2019 in Freiburg

Are you ready for compliance testing from physical to upper layers of automotive Ethernet?

#Automotive #Ethernet and AVB/TSN – Overview, testing & demo TC8 conformance testing regarding AUTOSAR Service Primitives Automotive Future Outlook

IHR GmbH News Februar 2019 - March,14 2019

Automotive Ethernet Testing

Impressions of the 5th Automotive Ethernet Congress in Munich

Impressions of the 5th Automotive Ethernet Congress in Munich

Visit us at the MD&M West 2020 in the Anaheim Convention Center
CA, Kalifornien